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63824-8400

Name: Molex 63824-8400
Brand: Molex
SKU: 538-63824-8400
Price: 104.68 CAD
Availability: InStock

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Mouser #:

538-63824-8400

Mfr. #:

63824-8400

Mfr.:

Molex

Description:

Extraction, Removal & Insertion Tools EXTRACTION TOOL

Datasheet:

63824-8400 Datasheet

In Stock: 7

Stock:: 7 Can Ship Immediately

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Factory Lead-Time:: 3 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

This Product Ships FREE

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$104.68	$104.68
	$97.02	$485.10
	$93.82	$938.20
	$89.93	$2,248.25
	$88.77	$8,877.00
	$88.37	$17,674.00
500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Extraction, Removal & Insertion Tools
Product:	Extraction Tools
Type:	Extraction Tool
Description/Function:	Extraction Tool for 2.50mm Pitch Mini-Lock Wire-to-Board Female Terminal
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Product Type:	Extraction / Insertion Tools
Series:	207123
Factory Pack Quantity:	1
Subcategory:	Tools
Tradename:	Mini-Lock
Part # Aliases:	638248400 0638248400
Unit Weight:	38.432 g

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Datasheet

63824-8400 Datasheet

RoHS Certificate (PDF)

USHTS:: 8205598000
JPHTS:: 820559000
BRHTS:: 82055900
ECCN:: EAR99

Application Tooling

Molex Application Tooling offers various production equipment designed and tested to ensure a high-quality electrical connection. Using the proper interconnect manufacturer’s tooling is essential to meeting many industry standards and maintaining the connector manufacturer’s product warranty. Molex Application Tooling delivers the application tooling to ensure the right connection is made every time.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.