It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

Return to Search Results

See an Error?

2313564

Name: Bergquist Company 2313564
Brand: Bergquist Company
SKU: 951-2313564
Price: 214.69 CAD
Availability: OutOfStock

Mouser #:

951-2313564

Mfr. #:

2313564

Mfr.:

Bergquist Company

Description:

Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500

This product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2313564 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

Availability

Stock:: 0

You can still purchase this product for backorder.

An unexpected error occurred. Please try again later.
Factory Lead-Time:: 4 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 7 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$214.69	$1,502.83
	$192.90	$1,929.00
	$180.91	$4,522.75
	$174.38	$8,719.00
	$174.34	$17,434.00
250	Quote

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Series:	1500 / TGF 1500
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Gap Filler
Part # Aliases:	2840176100100
Unit Weight:	3.24 kg

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

2313564 Datasheet (PDF)

Data Center Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components properly function for optimal operation.