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F3L150R07W2H3B11BPSA1

Name: Infineon F3L150R07W2H3B11BPSA1
Brand: Infineon Technologies
SKU: 726-F3L150R07W2H3B11
Price: 105.18 CAD
Availability: InStock

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Mouser #:

726-F3L150R07W2H3B11

Mfr. #:

F3L150R07W2H3B11BPSA1

Mfr.:

Infineon Technologies

Description:

IGBT Modules EASY

Datasheet:

F3L150R07W2H3B11BPSA1 Datasheet (PDF)

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In Stock: 11

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Factory Lead-Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$105.18	$105.18
	$91.36	$913.60
	$79.93	$8,392.65
510	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	IGBT Modules
Product:	IGBT Silicon Modules
Configuration:	3-Phase Inverter
Collector- Emitter Voltage VCEO Max:	650 V
Collector-Emitter Saturation Voltage:	1.68 V
Continuous Collector Current at 25 C:	150 A
Gate-Emitter Leakage Current:	100 nA
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	AU
Product Type:	IGBT Modules
Series:	EasyPACK 2B
Factory Pack Quantity:	15
Subcategory:	IGBTs
Technology:	Si
Tradename:	EasyPACK
Part # Aliases:	F3L150R07W2H3_B11 SP001064170

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Datasheet

F3L150R07W2H3B11BPSA1 Datasheet (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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USHTS:: 8541290065
TARIC:: 8541290000
ECCN:: EAR99

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

650V 3-level IGBT Modules

Infineon Technologies 650V 3-level IGBT Modules are EasyPACK™ modules with Trench/Fieldstop technology. These modules feature low inductive design, low switching losses, and low V_CE(sat). The IGBT modules provide Al₂O₃ substrate with low thermal resistance, compact design, PressFIT contact technology, and rugged mounting due to integrated mounting clamps. Potential applications include three-level applications, motor drives, solar applications, and UPS systems in EasyPACK™ modules.