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5557-4X10

Name: 3M 5557-4X10
Brand: 3M Electronic Specialty
SKU: 517-5557-4X10
Price: 75.44 CAD
Availability: InStock

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Mouser #:

517-5557-4X10

Mfr. #:

5557-4X10

Mfr.:

3M Electronic Specialty

Description:

Adhesive Tapes Water Contact Indicator Tape White, 4 in x 10yds Roll

Datasheet:

5557-4X10 Datasheet (PDF)

More Information

Learn more about 3M Electronic Specialty 5557-4X10

In Stock: 72

Stock:: 72

Can Ship Immediately

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On Order:: 32
Factory Lead-Time:: 11

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$75.44	$75.44
	$61.84	$618.40
	$56.41	$1,410.25
	$52.83	$2,641.50
	$51.03	$5,103.00
	$49.12	$12,280.00
500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	3M
Product Category:	Adhesive Tapes
RoHS:
Product:	Tapes
Type:	Water Indicator
Description/Function:	Water Contact Indicator Tape. The Tape Turns from White to Red Upon Direct Water Contact
Color:	White
Material:	Polyester
Adhesive Type:	Acrylic
Width - in:	4 in
Width - mm:	101.6 mm
Length - in:	10 yd
Length - mm:	9.14 m
Brand:	3M Electronic Specialty
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Tape
Factory Pack Quantity:	1
Subcategory:	Supplies
Thickness:	0.259 mm
Part # Aliases:	7000050152
Unit Weight:	742.172 g

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Datasheet

5557-4X10 Datasheet (PDF)

CNHTS:: 3919109900
USHTS:: 3822190080
TARIC:: 3919108090
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.