87715-9306

Molex
538-87715-9306
87715-9306

Mfr.:

Description:
PCI Express / PCI Connectors VERT THRU-HOLE 164P 30 plated

Datasheet:
ECAD Model:
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More Information
Learn more about Molex 87715-9306

In Stock: 397

Stock:
397 Can Ship Immediately
Factory Lead-Time:
17 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (CAD)

Qty. Unit Price
Ext. Price
$10.96 $10.96
$9.62 $96.20
$8.69 $217.25
$8.28 $414.00
$8.05 $805.00
$7.66 $1,915.00
$7.29 $3,645.00
$6.86 $6,860.00
$6.68 $16,833.60

Product Attribute Attribute Value Select Attribute
Molex
Product Category: PCI Express / PCI Connectors
RoHS:  
PCI Express
164 Position
Through Hole
Vertical
Through Hole
Tin
Gold
87715
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1.1 A
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Packaging: Tray
Product Type: PCI Express / PCI Connectors
Factory Pack Quantity: 630
Subcategory: Card Edge Connectors
Voltage Rating: 50 VAC/DC
Part # Aliases: 0877159306
Unit Weight: 8.500 g
Products found:
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Attributes selected: 0

Datasheet

Models

PCN

CAHTS:
8536690020
CNHTS:
8536901100
TARIC:
8536693000
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

PCI Express Edgecard Connectors

Molex PCI Express Edgecard Connectors offer a third-generation I/O architecture. PCI-SIG revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5GT/s (gigatransfer per second) to 5GT/s per lane. PCI Express supports high-bandwidth applications and is also backward compatible with PCI Express 1.1 version products.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

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