1812AFTC-412K-01

Name: Fastron 1812AFTC-412K-01
Brand: Fastron
SKU: 434-1812AFTC-412K
Price: 0.88 CAD
Availability: OutOfStock

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Mouser #:

434-1812AFTC-412K

Mfr. #:

1812AFTC-412K-01

Mfr.:

Fastron

Description:

NFC/RFID Transponder Coils 4.15mH 10% SRF 600

Datasheet:

1812AFTC-412K-01 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead-Time:: 10 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 600 Multiples: 600

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

This Product Ships FREE

Pricing (CAD)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 600)
	$0.881	$528.60
	$0.877	$1,052.40
	$0.854	$2,049.60
	$0.839	$4,027.20

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Fastron
Product Category:	NFC/RFID Transponder Coils
RoHS:
Package / Case:	4.9 mm x 3.8 mm x 3.65 mm
Inductance:	4.15 mH
Tolerance:	10 %
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Qualification:	AEC-Q200
Series:	1812AFTC
Packaging:	Reel
Brand:	Fastron
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MY
Height:	3.65 mm
Length:	4.9 mm
Product Type:	NFC/RFID Transponder Coils
Factory Pack Quantity:	600
Subcategory:	Inductors, Chokes & Coils
Width:	3.8 mm

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Datasheet

1812AFTC-412K-01 Datasheet (PDF)

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CAHTS:: 8504500000
CNHTS:: 8504500000
USHTS:: 8504508000
JPHTS:: 8504500001
KRHTS:: 8504509090
TARIC:: 8504509590
MXHTS:: 8504509102
BRHTS:: 85045000
ECCN:: EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.