2518131018Y8

Fair-Rite
623-2518131018Y8
2518131018Y8

Mfr.:

Description:
Ferrite Beads 1813 Case Size Multilayer Chip Bead

Datasheet:
ECAD Model:
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More Information
Learn more about Fair-Rite 2518131018Y8

In Stock: 2,791

Stock:
2,791 Can Ship Immediately
Factory Lead-Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (CAD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$1.42 $1.42
$0.996 $9.96
$0.857 $21.43
$0.761 $38.05
$0.637 $63.70
$0.566 $141.50
$0.538 $269.00
$0.502 $502.00
Full Reel (Order in multiples of 2500)
$0.502 $1,255.00
† $8.50 MouseReel™ fee will be added and calculated in your shopping cart. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
1813 (4532 metric)
100 Ohms
250 mA
25 %
1.2 Ohms
- 55 C
+ 125 C
4.5 mm
3.2 mm
2.3 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Number of Channels: 1 Channel
Number of Elements: 2 Element
Product Type: Ferrite Beads
Shielding: Shielded
Factory Pack Quantity: 2500
Subcategory: Ferrites
Type: Multilayer Chip Bead
Products found:
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Attributes selected: 0

Datasheet

CAHTS:
8548000000
CNHTS:
8548000001
USHTS:
8548000000
JPHTS:
854800000
TARIC:
8504509590
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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