TGP40000SF-0.020-01-0406-NA

Bergquist Company
951-TGP400SF.0200146
TGP40000SF-0.020-01-0406-NA

Mfr.:

Description:
Thermal Interface Products GAP PAD, Sil-Free, 40W/m-K, 4 x 6" Sheet, Tacky Pad, 0.020" Thickness, Thermexit

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 49

Stock:
49
Can Ship Immediately
On Order:
60
Factory Lead-Time:
6
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (CAD)

Qty. Unit Price
Ext. Price
$102.72 $102.72
$96.69 $966.90
$90.65 $1,813.00
$84.59 $5,075.40
$81.57 $8,157.00

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
101.6 mm
0.508 mm
TGP 40000SF
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Designed for: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
Height: 4 in
Product Type: Thermal Interface Products
Size: 4 in x 6 in
Factory Pack Quantity: 20
Subcategory: Thermal Management
Tradename: GAP PAD / Thermexit
Part # Aliases: TGP40000SF-0.020-01-0406 2988063
Unit Weight: 20 g
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Attributes selected: 0

USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.