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ATS-SG330-R0

Name: Advanced Thermal Solutions ATS-SG330-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-SG330-R0
Price: 13.91 CAD
Availability: OutOfStock

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Mouser #:

984-ATS-SG330-R0

Mfr. #:

ATS-SG330-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks clipKIT Attachment Heat Sink to PCB for Component Size 33x33mm, superGRIP Tech

Datasheet:

ATS-SG330-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-SG330-R0

Availability

Stock:: 0

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Factory Lead-Time:: 8 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$13.91	$13.91
	$12.31	$123.10
	$11.73	$234.60
	$11.30	$565.00
	$10.87	$1,087.00
	$10.22	$2,044.00
	$9.93	$4,965.00
	$9.62	$9,620.00
2,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	Component, 33x33mm
Mounting Style:	Clip
Length:	33 mm
Width:	33 mm
Brand:	Advanced Thermal Solutions
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-SG
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	clipKIT superGRIP
Type:	Component

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Filter Document:

Datasheet

ATS-SG330-R0 Datasheet (PDF)

Specification Sheets

superGRIP™ Datasheet (PDF)

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

Heat Sink Attachments

USHTS:: 7326908688
ECCN:: EAR99

superGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs with minimal space around mechanical attachment components. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.