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XCKU040-L1FBVA676I

Name: AMD XCKU040-L1FBVA676I
Brand: AMD / Xilinx
SKU: 217-KU040-L1FBVA676I
Price: 4008.49 CAD
Availability: OutOfStock

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Mouser #:

217-KU040-L1FBVA676I

Mfr. #:

XCKU040-L1FBVA676I

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XCKU040-L1FBVA676I

Datasheet:

XCKU040-L1FBVA676I Datasheet (PDF)

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Factory Lead-Time:: 22 Weeks Estimated factory production time.

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$4,008.49	$4,008.49

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
RoHS:
Series:	XCKU040
Number of Logic Elements:	530250 LE
Adaptive Logic Modules - ALMs:	30300 ALM
Embedded Memory:	21.1 Mbit
Number of I/Os:	328 I/O
Supply Voltage - Min:	850 mV
Supply Voltage - Max:	850 mV
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Data Rate:	16.3 Gb/s
Number of Transceivers:	20 Transceiver
Mounting Style:	SMD/SMT
Package / Case:	FBGA-676
Brand:	AMD / Xilinx
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	Not Available
Distributed RAM:	7 Mbit
Embedded Block RAM - EBR:	21.1 Mbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	30300 LAB
Operating Supply Voltage:	850 mV
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	40
Subcategory:	Programmable Logic ICs
Tradename:	Kintex UltraScale

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Datasheet

XCKU040-L1FBVA676I Datasheet (PDF)

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USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: 3A991.d

Kintex™ UltraScale+™ FPGAs

AMD / Xilinx Kintex™ UltraScale+™ Field Programmable Gate Arrays (FPGAs) feature the highest signal processing bandwidth in mid-range, next-generation transceivers. AMD / Xilinx Kintex UltraScale+ FPGAs are available for packet processing in 100G networking and data center applications. The FPGAs are also ideal for DSP-intensive processing needed in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure. Kintex UltraScale+ FPGAs are optimized for system performance and integration at 20nm and enabled by monolithic and next-generation stacked silicon interconnect (SSI) technology.